Nasdaq

Ansys Enables 3D Multiphysics Visualization of Next-Generation 3D-IC Designs with NVIDIA Omniverse

PITTSBURGH, June 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced that it is adopting NVIDIA Omniverse application programming interfaces (APIs) to offer 3D-IC designers valuable insights ...

Samsung Collaborations On 2nm And 3D‑IC Put Investor Focus On Valuation

Samsung Electronics has expanded its collaborations with Synopsys and Cadence on next-generation chip design and manufacturing flows for its leading 2nm and 3D-IC technologies. The partnerships cover ...
Manila Standard

Cadence and Samsung Foundry deepen 2nm and 3D‑IC collaboration to meet surging AI infrastructure and physical AI demand

Multi-year agreement expands Memory, NVIDIA NVLink-C2C and advanced Interface IP, and agentic AI-optimized GPU‑accelerated ...
Nasdaq

Alpha and Omega Semiconductor Supports 800 VDC Power Architecture for Next-Generation AI Factories with Innovative SiC and GaN, Power MOSFET, and Power IC Solutions

The shift from traditional 54V power distribution to an 800 VDC system is a fundamental change in data center design, aimed at overcoming the physical limits of existing infrastructure. By reducing ...