There is much disagreement on the timing of the transition from copper interconnects to optical interconnects, but almost ...
Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems. Who ...
Autonomous machines promise to transform industries, but memory bottlenecks, power constraints, specialized architectures, ...
Shared resources, a mix of tools running at different speeds, and multiple dies are adding new challenges for design teams.
How data center operators can protect critical data and communications without compromising the performance demanded by distributed AI and HPC workloads.
SE: AI is disruptive to EDA, the semiconductor industry, and to their customers. One early indication is that computer ...
Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...
STCO for heterogeneous design; physical AI interactions; signing off AI-generated designs; workload profile analysis.
Accurate SI analysis must account for interactions across vertical interconnects, interposers, silicon bridges, package transitions, and neighboring high-speed channels.
Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.
Chiplets for physical AI; rack-level considerations; verification complexity; sparse matrix workloads; AI data centers.
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