Introducing Foveros, the industry’s first 3D stacking of logic chips, paving the way for smaller, more powerful devices. https://intel.ly/2FNgR6E | Intel
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AI needs the "brain power" of multiple chips. At Fab 9 in New Mexico, @Intel_Foundry creates systems of chips using Foveros 3D stacking to optimize space for laptops to be thinner with longer lasting batteries. 💻Watch how Foveros is created 👇
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The primary bottleneck that Intel faces with advanced packaging right now is helping with the transition for fabless customers who are looking for an alternative to CoWoS.There have been some 'recruits (ahm....)' that is helping Intel get customers, but advanced packaging is an attractive venue. It will become more appealing once 3D stacking becomes the new norm with accelerators like Feynman, and we know Foveros Direct-3D is a compelling solution.
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